<![CDATA[Gizmodo: chipset]]> http://tags.gizmodo.com/assets/base/img/thumbs140x140/gizmodo.com.png <![CDATA[Gizmodo: chipset]]> http://gizmodo.com/tag/chipset http://gizmodo.com/tag/chipset <![CDATA[Intel May Postpone USB 3.0 Support on Chipsets Until 2011]]> A report has surfaced alleging that Intel has pushed back the implementation of USB 3.0 in its chipsets a whole year, to early 2011. It's unconfirmed, and we hope it's not correct—it'd seriously slow down USB 3.0's adoption.

Without Intel supporting the standard, motherboard manufacturers and gadget makers alike would probably hold off on using USB 3.0, since it would require a relatively expensive third-party controller (as it does now). An Intel rep said he hadn't heard of such a delay, but with Intel focused on its next-gen Nehalem chips (and given the company's neglect of wireless USB), it's not impossible. We'll keep you updated if we get confirmation either way. [EE Times via Tech Report]

]]>
http://gizmodo.com/index.php?op=postcommentfeed&postId=5390483&view=rss&microfeed=true
<![CDATA[Apple Working on Software Fix For iPhone 3G Reception Problems]]> According to Businessweek, the solution to the iPhone 3G's chipset issues could be easier than most of us probably expected. Apparently, Apple set up the Infineon chip to demand more of a 3G signal than was necessary, which resulted in a switch back to the slower network if there are too many people in the area using an iPhone at the same time. This involves an issue with software on the chip which can probably be remedied through an upgrade instead of a costly and annoying recall. Businessweek claims that Apple and chip maker Infineon are hard at work on the fix and it could be released as early as the end of this month. [Businessweek via CNET]

]]>
http://gizmodo.com/index.php?op=postcommentfeed&postId=5037117&view=rss&microfeed=true
<![CDATA[iPhone 3G's Sluggish 3G Could Be Caused By Lousy Chipset]]> GigaOm quotes Richard Windsor, an analyst with Nomura Securities, in saying that the sluggish 3G performance of the iPhone 3G seen globally (not just with AT&T) could be a result of a lousy chipset. He says, "we believe that these issues are typical of an immature chipset and radio protocol stack where we are almost certain Infineon is the 3G supplier." Is this true?

AT&T has stated that problems are not on their end in the US, and European countries also stated that they've seen slowness with the iPhone on their network where every other phone was fine. Forums everywhere have been complaining about lousy reception compared to other phones in their network—even in Japan—which secures that it's a hardware issue. Our guess is that Apple will somewhere down the line either run an update to the protocol stack via an upgrade, or quietly swap out the chipset for a more mature one that may or may not be made by Infineon. [GigaOm]

]]>
http://gizmodo.com/index.php?op=postcommentfeed&postId=5036104&view=rss&microfeed=true
<![CDATA[Intel's Centrino 2 Gets Official Launch, Alongside Core 2 Extreme]]> We learned in May that there would be delays to Intel's Centrino 2 chipset for notebooks, but today it gets an official launch from Intel. That certainly tallies with the slew of notebooks hitting the news which have the chips inside. Alongside the Centrino 2, Intel gives us word on the Core 2 Extreme, which runs at 3.06 GHz and the Mobile Intel 45 Express Chipset and wireless Intel Wi-Fi Link 5000, and the WiMAX/Wi-Fi Link 5050 chipset that supports the Centrino 2 to support WiMax and Wi-Fi operations. Since Intel plans to release eight processors over the next 90 days, there'll be lots more news like this. Press release below.

Jul 15, 2008 00:01

New Intel-Based Laptops Advance All Facets of Notebook PCs

New Intel(R) Centrino(R) 2 Processor Technology Brings 'HD-to-Go'; Adds Security and Manageability Features, Boosts Speed, Battery Life and Wireless Range
SAN FRANCISCO —(Business Wire)— Jul. 15, 2008 Intel Corporation unveiled its Intel(R) Centrino(R) 2 Processor Technology products for laptops today, powered by five new Intel(R) Core(TM) 2 Duo processors. Close to 250 innovative consumer and business notebook PC designs are on the way, including those equipped with the right combination of powerful processors, graphics and battery life to enjoy viewing stunning high definition videos and myriad other computer and Internet activities.

Intel also introduced the world's highest-performing dual-core mobile processor, the Intel(R) Core(TM)2 Extreme processor running at a brisk 3.06 GHz, as measured by SPECint(1)_rate_base2006, an industry benchmark (http://www.spec.org)(2).

Rounding out a mobile-focused summer for the company, Intel said it also plans to unveil eight processors within 90 days that will include first-ever mobile quad-core products and second-generation products for ultra-thin and light notebooks. In total, Intel will bring 14 diverse new processors into the marketplace as laptop sales continue to outpace desktop PCs.

Formerly codenamed Montevina, Intel Centrino 2 processor technology and Intel(R) Centrino(R) 2 with vPro(TM) Technology improve upon every facet of a laptop's main features, including performance and battery life via new processors and chipsets, faster draft 802.11n wireless (with WiMAX arriving later this year), and new business-class manageability capabilities.

"When we first introduced Intel Centrino back in 2003, there were very few Wi-Fi hotspots, YouTube videos and social media didn't really exist, 'thin and light' only referred to weight goals and desktop PCs outsold notebooks by a very wide margin," said Mooly Eden, Intel corporate vice president and general manager of the company's Mobile Platforms Group. "Today, notebooks outsell desktops in the U.S., and we're paving the way to HD entertainment, rich online gaming, faster broadband wireless speeds and an easier and more secure way for businesses to manage, update and repair their notebook fleets."

Intel is introducing five dual core processors based on Intel's reinvented transistors (high-k metal gate formula) and advanced 45-nanometer manufacturing process. These processors come with a faster 1066MHz front side bus and up to 6MB of L2 cache, and three versions reduce laptop processor wattage about 30 percent, down to just 25 watts. Also featured is Deep Power Down Technology that turns off processing components such as core clocks and cache memory when the laptop is idle for greater energy savings.

Intel also unveiled its Mobile Intel(R) 45 Express Chipset and wireless Intel(R) Wi-Fi Link 5000 series that is shipping to customers now, with laptops arriving later in July and August. Delivering five times the speed and twice the range of older 802.11a/g technology, the Intel Wi-Fi Link 5000 series provides 802.11 draft-N support that delivers the fastest data rates possible today — up to 450 Mbps.

Switchable graphics, a new optional power-saving feature available on Intel Centrino 2-based notebooks, provides both integrated and discrete graphics on a single notebook, enabling users to easily switch between the two options. Switchable graphics delivers greater 3-D performance when needed while providing the option for greater power savings for the best of both worlds.

For consumers, Intel Centrino 2 processor technology delivers the horsepower and battery life to enjoy a typical full-length, Blu-ray(1) high-definition video on a single battery charge for the first time, plus the ability to play a variety of online games, download music or post videos faster than before.

For businesses, Intel Centrino 2 with vPro technology offers enhanced manageability and security options. This is increasingly important as companies replace desktops with notebooks and need to remotely diagnose, update and repair systems over a wireless network. Improved manageability with AMT 4.0 has also been added that provides wireless manageability during system sleep states, ongoing remote configuration capabilities, support for next-generation management standards (WS-MAN and DASH 1.0) and the ability for an employee to initiate communications to IT from outside a company's firewall.

OEMs and Channel system builders will deliver close to 250 systems to market. For more information including Intel product pricing, visit http://www.intel.com/go/processor_pricing. For a full media version of this release including photos, videos, related blogs and other information, visit http://www.intel.com/pressroom/archive/releases/20080715comp_sm.htm and the Intel Centrino 2 technology press kit at http://www.intel.com/pressroom/kits/centrino2.

WiMAX Momentum

Later this year in the United States, Intel will begin shipping its first-ever combined WiMAX/Wi-Fi module, part of the Intel(R) WiMAX/Wi-Fi Link 5050 Series that is an optional feature for future Intel Centrino 2-based laptops. WiMAX is a 4G, Internet protocol-based broadband wireless technology that complements Wi-Fi networks.

WiMAX also provides much wider Internet and phone voice coverage, and unlike Wi-Fi has the ability to unwire entire cities or communities, connecting users even when they're on the move. Intel is working with service providers around the world to deploy WiMAX networks, with initial U.S. network availability starting later this year from Sprint XOHM and Clearwire.

]]>
http://gizmodo.com/index.php?op=postcommentfeed&postId=5025234&view=rss&microfeed=true
<![CDATA[Samsung Intros Cell-Phone Chip With 4GB of On-Board Memory]]> It's a sad day for the cell-phone carriers, and anyone else who profiteers by selling overpriced and easy-to-lose MicroSD cards for your phone, because Samsung just announced moviMCP.

No relation to the evil Master Control Program, it is rather an entertainment chipset for mobile phones. It includes 128MB of RAM and 256MB of flash memory for the main phone operations, plus 4GB of bonus flash memory for multimedia files, such as porn home movies and legally obtained musical tracks. The memory resembles the MMC format used by SD cards, so developers don't have to worry about writing in extra support. And, you ask, what does this mean for the iPhone? Potentially, an even trimmer figure in years to come.

Samsung Develops High-Density Memory that Greatly Simplifies Handset Design [Samsung via Electronista]

]]>
http://gizmodo.com/index.php?op=postcommentfeed&postId=264401&view=rss&microfeed=true
<![CDATA[PS3: So Close, We Can Taste It]]> This is a bit roundabout, but it's interesting. IC testing house King Yuan Electronics Company, which tests chips that go into the PSP and the Xbox 360, is currently testing a great number of PS3 chipsets, thereby improving their overall financial standing and proving to us that the PS3 should be hitting the streets very, very soon.

"Sources at equipment makers stated that KYEC has already started testing engineering chipset samples for PS3," writes Digitimes, and this essentially means that they're ramping up for full production.

KYEC said to benefit from ramping PS3 chip testing orders from 2Q06 [DigiTimes via TheInquirer]

]]>
http://gizmodo.com/index.php?op=postcommentfeed&postId=169062&view=rss&microfeed=true
<![CDATA[Size Doesnt Matter for Swedish Wi-Fi]]> Nanoradio AB has revealed their ultra-small Wi-Fi chipset today. The NRX700 chip measures 20mm2. Additionally this Wi-Fi chipset is claiming to have the lowest power consumption for a Wi-Fi chip. Nanoradio would ideally like to see their chipset in all of the next-generation mobiles device such as phones, media players and PDAs. Nanoradio, the Swedish semiconductor supplier, will be sending out samples to manufacturers later this year with production beginning in early 2007.

Smallest WiFi solution yet! [MobileMag]

]]>
http://gizmodo.com/index.php?op=postcommentfeed&postId=155351&view=rss&microfeed=true
<![CDATA[IBM Aims to Replace Bluetooth and WiFi with New Chipset]]> IBM is crowing about its new chipset that would allow wireless communication at gigabit speeds. Announced at the International Solid-State Circuits Conference, the minuscule component measures just 14mm per side, and includes antennas that will allow data transfers far faster than Bluetooth or WiFi. This announcement, called revolutionary by some, could bring consumer electronics closer to the era of the Wireless Personal Area Network (WPAN), where cables are eliminated, even between bandwidth-hungry high-definition devices.

IBM has been on a roll lately, claiming the upcoming Power6 chips will run at speeds heretofore unheard of. It's a lot of big talk.

If IBM can actually bring this completely wireless WPAN concept to life, it's bye-bye Bluetooth and Wi-Fi, all in one swoop. But Big Blue will face resistance from consumer electronics manufacturers who already have big investments in already-existing technology. (Not to mention consumers.)

IBM's WPAN chipset aims to replace high-def cables, Bluetooth [TG Daily]

]]>
http://gizmodo.com/index.php?op=postcommentfeed&postId=153545&view=rss&microfeed=true