<![CDATA[Gizmodo: Intel Developers Forum]]> http://cache.gawker.com/assets/base/img/thumbs140x140/gizmodo.com.png <![CDATA[Gizmodo: Intel Developers Forum]]> http://gizmodo.com/tag/intel developers forum http://gizmodo.com/tag/intel developers forum <![CDATA[ Intel Says They've Taken A Huge Leap in Wireless Power Tech ]]> Wireless power for charging gadgets has been among the more vaporous of developments we've been hearing promises of for years. While there are a few working instances of the tech on the market, its large-scale adoption still feels miles away. So the appropriate skepticism should be applied to this NY Times report claiming Intel will announce a major wireless power breakthrough today at the Intel Developers Forum, but the details do seem enticing this time around for one of the holy grails of the CE world soon becoming a bit more feasible. UPDATED: Pics of Intel's IDF demo from today have been added.

Intel's work builds on the progress MIT has made with transmitting power through resonant magnetic fields. But where the MIT team, led by Marin Soljacic, has only achieved 50% efficiency over a range of a few feet, Intel is said to have recently zapped up to 60 watts over the same distance at an efficiency of 75%, which is quite a leap forward.

Intel also is extrapolating potential uses of the tech for supercapicitors—basically giant electrochemical "batteries" that recharge almost instantly compared to Li-ion and store over a thousand times more juice than standard capacitors.

Sounds good. We'll keep you posted on any developments from IDF today. UPDATE: Intel didn't tell us anything we didn't know already in their IDF demo today, which lit a lightbulb from a distance of a few feet by passing electricity between two coils. We were assured, though, that being in the middle of the electrically charge resonant magnetic field doesn't hurt one bit.

[New York Times, Photos: John Herrman]

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Thu, 21 Aug 2008 09:30:00 EDT John Mahoney http://gizmodo.com/index.php?op=postcommentfeed&postId=5039871&view=rss&microfeed=true
<![CDATA[ Intel's Latest System-On-A-Chip is For Web Enabled TVs, Set-Top Boxes ]]> Only a month or so after announcing intentions to dabble in the SoC game for embedded systems, Intel's showing off its first iteration at the Intel Developers Forum. The CE 3100 (previously known as "Canmore" in Intel speak) combines HD video processing, "home theater quality" audio and 3D graphics with the internet connectedness to run widgets from Yahoo's Widget Channel on TVs and STBs like the mockup you see here. Great, another web-connected TV platform.

Intel and Yahoo's solution can pull down Flickr photos, weather, and related TV content and dump it into widgets along the bottom of the screen. It's nothing we haven't seen before. But at least now Intel's FCC plea for mandatory ethernet jacks on all STBs makes a lot more sense. The folks at Laptop had a chance to walk through the interface:

CE 3100 predates Atom, so it does not appear to be the Atom-based SoCs hinted at previously. Also, it packs more muscle than what's required to simply dump some web widgets on the screen, so we'll probably see some more robust media extender technology running on the platform soon. [Video: Laptopmag]

Full release from IDF:

Intel Introduces First IA System on Chip for Consumer Electronics, Expands Internet to TV Experience

Internet on TV Collaboration with Yahoo!®, Mobile Internet Device Momentum and ‘Boundless’ Opportunities for Software Developers Highlighted
IDF San Francisco 2008

SAN FRANCISCO—(BUSINESS WIRE)—NOTE TO EDITORS: photos, videos and more facts available at www.intel.com/pressroom/idf.

At the Intel Developer Forum, Intel Corporation introduced the Intel® Media Processor CE 3100, the first in a new family of purpose-built System on Chips (SoCs) for Consumer Electronics devices based on the company’s popular Intel Architecture (IA) blueprint.

Executives on Wednesday also provided updates on the Mobile Internet Device (MID) category and Intel Atom™ processor, unveiled a brand with DreamWorks Animation SKG Inc. around the shift to 3-D movie-making and outlined a number of efforts to speed many-core processor software design.

The CE 3100 has been developed for Internet-connected consumer electronics (CE) products such as optical media players, connected CE devices, advanced cable set top boxes and digital TVs. The media processor (previously codenamed “Canmore”) combines leading-edge CE features for high-definition video support, home-theater quality audio and advanced 3-D graphics, with the performance, flexibility and compatibility of IA-based hardware and software. Intel expects to begin shipments of this product next month.

Intel and its customers have been working together to develop a variety of products for emerging growth areas – consumer electronics, MIDs, netbooks and embedded computers – each based on Intel architecture that enables uncompromised Internet access.

“As consumers look to stay connected and entertained regardless of where they are and what device they are using, the Web continues to affect our lives in new ways and is quickly moving to the TV thanks to a new generation of Internet-connected CE devices,” said Eric Kim, Intel senior vice president and general manager of the company’s Digital Home Group. “As Intel delivers its first IA SoC with leading-edge performance and Internet compatibility for consumer electronics devices, we are providing a powerful and flexible technology foundation upon which the industry can quickly innovate upon. This technology foundation will help the high-tech industry bring devices to market faster, as well as encourage new designs and inspire new services, such as connecting the TV to the Internet.”

“I Love TV” – Intel Extends the Power of IA into Consumer Electronics

As another SoC product from Intel, the Intel Media Processor CE 3100 is a highly integrated solution that pairs a powerful IA processor core with leading-edge multi-stream video decoding and processing hardware. It also adds a 3-channel 800 MHz DDR2 memory controller, dedicated multi-channel dual audio DSPs, a powerful 3-D graphics engine enabling advanced UIs and EPGs, and support for multiple peripherals, including USB 2.0 and PCI Express.

The Intel Media Processor CE 3100 also features Intel® Media Play Technology that combines hardware-based decoding for broadcast TV and optical media playback with software-based decode for Internet content. When a consumer watches broadcast TV or content on optical media players, the video is encoded in standard formats, such as MPEG-2, H.264 or VC-1. Intel Media Play Technology software routes the video to the on-chip hardware decoders. When viewing Internet content, the software automatically routes the video, and audio as applicable, to a software codec running on the IA processor core. As the Internet becomes more omnipresent, the ability to decode multiple video and audio formats will provide the industry with greater flexibility to evolving standards and technologies, and consumers with more viewing experiences.

The Intel Media Processor CE 3100 is scheduled to ship to CE manufacturers, including Samsung Electronics Co., Ltd.1 and Toshiba1. More information is available at www.intel.com/go/celink.

In related news, Intel and Yahoo! Inc. previewed an applications framework for televisions (TV) and related CE devices that use the Intel Architecture, which blends the openness, personality and community aspects of the Web with the simplicity and entertainment strengths of the TV. This application framework, called the Widget Channel, introduces a new and user-friendly way to enjoy Web content while watching TV programs. The Widget Channel is powered by the Yahoo! Widget Engine and is optimized to use the performance and the capabilities of Intel Media Processor CE 3100. [A separate press release and more information about the Widget Channel and the Yahoo! Widget Engine are available at www.intel.com/pressroom/idf or connectedtv.yahoo.com/newsroom.]

Intel also announced the formation of The Intel® Consumer Electronics Network, a member-based community of hardware, software and services providers aimed at speeding the delivery of Internet-connected CE devices based on IA SoCs. Together, the network, which includes Alticast Inc1., Futarque A/S1, Giga-Byte Technology Co., LTD1, Tatung Co1., Unihan Corporation, Videon Central Inc1., and VividLogic Inc1., will receive early access to Intel CE platforms and will work to develop and market more feature-rich products to ultimately provide consumers with more choice.

Mobile Internet Devices: “Platform for Innovation”

Anand Chandrasekher, Intel senior vice president and general manager for the Ultra Mobility Group, discussed how Intel® Atom™ processor Z5xx series-based MIDs are becoming platforms for innovation in the mobile ecosystem. He added that the Internet revolution continues unabated with the rapid growth of social networking, user-generated content and location-based services. These trends are even more important for mobile users who are demanding the right device to take this experience with them.

Building on the launch of the Intel Atom processor for MIDs in April, Chandrasekher reinforced the growing need for performance, Internet and software compatibility, and wireless broadband connectivity in order to bring Internet innovations to pocketable devices. He showcased a range of MIDs coming to market across the target market segments and welcomed executives from Clarion1 and Panasonic1 to launch their products in the U.S. market. Chandrasekher also demonstrated the world’s first full 1080p high-definition video playback in a handheld device on the upcoming OQO1 MID. Additionally, he highlighted MIDs from Fujitsu1 and Lenovo1.

Supporting the diverse range of devices spotlighted at IDF this week in San Francisco is a rapidly developing software ecosystem based on the Moblin-based operating system. More than 10 software vendors, including GyPSii1 for social networking, Fuel Games1 for online gaming, Move Networks1 for Internet TV programming and Neusoft1 for UI and applications, announced plans for making their applications available for Moblin-based MIDs.

Continuing on the path of innovation, Chandrasekher reinforced Intel’s MID roadmap with the next-generation platform codenamed “Moorestown,” which is on track for 2009/2010. Holding up the first wafer, he announced that first silicon has been produced, reinforced the versatility of the architecture, and the opportunity to target the communication MID with data and voice capabilities.

Developing for the Future of Computing

Renee James, vice president and general manager of Intel’s Software and Solutions Group, described how software developers play an essential role in bringing emerging technologies and Internet opportunities to life. Processor performance and the move to Intel’s multi-core processors with multi-threaded software are accelerating advancements in all aspects of visual computing for richer and more believable experiences.

James and DreamWorks Animation1 CEO Jeffrey Katzenberg jointly unveiled a new brand, InTru™ 3D, that will represent the next generation of movie storytelling and enhanced 3-D viewing experience. The InTru 3D logo represents stunning computer generated 3-D imagery made possible by the unique combination of Intel technology and DreamWorks creativity. The logo will be employed by Intel and DreamWorks in promotion of 3-D movies, and presented within all of DreamWorks’ 3-D movies beginning with “Monsters vs. Aliens.”

James also announced Visual Adrenaline, Intel’s new visual computing developer program. The program offers resources to help developers, publishers, artists, animators and other gaming and digital content creation and consumption professionals take full advantage of Intel products and technologies as they create tomorrow’s most compelling visual experiences. More information on Visual Adrenaline is available at www.intel.com/software/visualadrenaline.

Additionally, Intel announced the next generation of parallel programming tools that offer new options for multi-core software development for mainstream client applications. The Intel® Parallel Studio includes expanded capabilities for helping design, code, debug and tune applications to harness the power of multi-core processing through parallel programming. Intel Parallel Studio will ease the path for parallel application development to deliver performance and forward scaling to many-core processors for Microsoft Visual Studio developers. For more information, visit www.intel.com/go/parallel.

About Intel

Intel (NASDAQ:INTC), the world leader in silicon innovation, develops technologies, products and initiatives to continually advance how people work and live. Additional information about Intel is available at www.intel.com/pressroom and blogs.intel.com.

Intel, Intel Atom and the Intel logo are trademarks of Intel Corporation in the U.S. and other countries.

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Wed, 20 Aug 2008 18:02:42 EDT John Mahoney http://gizmodo.com/index.php?op=postcommentfeed&postId=5039692&view=rss&microfeed=true
<![CDATA[ Intel Sends in the iPhone Clones at IDF '07 ]]> Intel showed off some intriguing devices today at the ultramobility keynote at the Intel Developers Forum (IDF) Fall 07, and the most notable example was this strange-looking cellphone/portable PC, which is pretty much an iPhone clone running on Intel's Moorestown platform. More pics and context, post-jump.


If you're not familiar with Moorestown, it will be packing 45nm processors, and integrates the graphics, video and memory controller all in one efficient chip, sipping battery power so frugally that devices using it'll be able to go 24 hours on a charge.

This piece of vaporware appears to be a stretch iPhone, looking just like Apple's cellphone darling but twice as wide, giving you enough room for a virtual keyboard to slide in on each side without obstructing your web browsing. But sheesh, how is that sucker going to fit in your pocket? Looks like a rearview mirror. Don't expect to see this as a shipping product until at least 2009. [Anandtech]

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Wed, 19 Sep 2007 16:33:52 EDT Charlie White http://gizmodo.com/index.php?op=postcommentfeed&postId=301614&view=rss&microfeed=true
<![CDATA[ Intel Plans Move From 45nm to 32nm Chips ]]> 497-bunny.jpgIntel's 45nm Penryn chips aren't even out yet and they're talking about going smaller. Yesterday at their Developers Forum, CEO Paul Otellini, showed off a 300mm wafer built using an impresive 32nm process. Each 32nm chip will contain over 1.9 billion transistors. That's more than 1.4 billion extra transistors compared with the 65nm chips that we have now. [PCWorld]

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Wed, 19 Sep 2007 15:12:17 EDT blongo3 http://gizmodo.com/index.php?op=postcommentfeed&postId=301548&view=rss&microfeed=true
<![CDATA[ Asustek Shows Concept Laptop With Secondary Display ]]> Asustek takes a cue from cellphones, showing off this concept laptop with a secondary display on the outside, letting you give get a quick peek at your e-mail, check your schedule or see what's playing on the MP3 player without having to open it up. Just think of it: now you can check your e-mail on your laptop while it rides the conveyor belt through those impregnable security scanners that are protecting us from the terrorists.

Asus tech showed the notebook at the Intel Developer Forum in San Francisco, and that they're not the only ones—Acer and Mitac Technologies are also reportedly jumping on the secondary display notebook bandwagon. If the big boys take notice, this could become a standard feature in the near future.
Asustek presents notebook with "second display" design [DigiTimes]

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Thu, 28 Sep 2006 09:16:59 EDT Charlie White http://gizmodo.com/index.php?op=postcommentfeed&postId=203849&view=rss&microfeed=true