IBM Developing Water-cooled, '3D' Semiconductors

Straight out of IBM's Zurich R&D labs are these concepts for semiconductor chips that are stacked on top of eachother and allow enough space in between for water cooling. Developed jointly with the Fraunhofer Institute in Berlin, the '3D' stacking of these chips not only uses less space and allows for greater speed,… » 6/05/08 7:46pm 6/05/08 7:46pm