The NYTimes has a post on Vertical Circuits, a company that has developed a 3d circuit stacking technology using a silver based epoxy—goo, basically—to closer fuse flash memory chips together.
The goo surpasses other 3d circuit technologies based on wires or solid material because it saves even more space. In that case, we’re talking about 1.6mm of height, but that’s enough to fit in a bigger screen or battery in something as thin as an mp3 player or slim phone.
The piece is pegged to ex CEO of Seagate Bill Watkins‘ arrival there. [NYT]
