Semiconductor Energy Laboratory and TDK Corporation have created the first bendable passive RFID tag. The prototype is 800um thick and process improvements look to move the thickness of the RFID compnents closer to 100um which would cut the final size in half. Since paper is commonly over 300um, the tag could be embedded in documents and would not alter the shape or texture of the paper. This would allow for RFID-enabled business cards and contracts can be made RFID tamper-resistant—perhaps moving DRM into the analog world of contracts.
Bendable RFID Tag [NA Asia Online]
